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Apple's Vice president of Hardware Engineering John Ternus discusses the internal hardware of the Mac Pro during Apple's Worldwide Developer Conference (WWDC) in San Jose, California on June 3, 2019
A new type of 300 millimeter wafer with semiconductor chips and finished microchips of the semiconductor German manufacturer Bosch are seen in Dresden, eastern Germany on May 31, 2021 (Photo by JENS SCHLUETER/AFP via Getty Images)
A new type of 300 millimeter wafer with semiconductor chips and finished microchips of the semiconductor German manufacturer Bosch are seen in Dresden, eastern Germany on May 31, 2021 (Photo by JENS SCHLUETER/AFP via Getty Images)
Commentary
CHIPs Funding Should Feed the Future, Not the Corporate Trough
bryan_clark
bryan_clark
Bryan Clark
Senior Fellow and Director, Center for Defense Concepts and Technology
dan_patt
dan_patt
Dan Patt
Senior Fellow, Center for Defense Concepts and Technology
Bryan Clark & Dan Patt
Commentary
4 Min Read
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