Technology

Apple's Vice president of Hardware Engineering John Ternus discusses the internal hardware of the Mac Pro during Apple's Worldwide Developer Conference (WWDC) in San Jose, California on June 3, 2019
Sen. Carl Levin (D-MI) questions a witness during a hearing of the Permanent Subcommittee on Investigations of the Senate Homeland Security and Governmental Affairs Committee November 20, 2014 in Washington, DC (Photo by Win McNamee/Getty Images)
Caption
Sen. Carl Levin (D-MI) questions a witness during a hearing of the Permanent Subcommittee on Investigations of the Senate Homeland Security and Governmental Affairs Committee November 20, 2014 in Washington, DC (Photo by Win McNamee/Getty Images)
Commentary
casey_michel
casey_michel
Former Adjunct Fellow, Kleptocracy Initiative
7 Min Read
A new type of 300 millimeter wafer with semiconductor chips and finished microchips of the semiconductor German manufacturer Bosch are seen in Dresden, eastern Germany on May 31, 2021 (Photo by JENS SCHLUETER/AFP via Getty Images)
Caption
A new type of 300 millimeter wafer with semiconductor chips and finished microchips of the semiconductor German manufacturer Bosch are seen in Dresden, eastern Germany on May 31, 2021 (Photo by JENS SCHLUETER/AFP via Getty Images)
Commentary
bryan_clark
bryan_clark
Senior Fellow and Director, Center for Defense Concepts and Technology
dan_patt
dan_patt
Senior Fellow, Center for Defense Concepts and Technology
4 Min Read
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