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A 49.5-megawatt data center is under construction on April 14, 2026, in Vernon, California. (Getty Images)
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President Donald Trump and Japanese Prime Minister Sanae Takaichi meet in Tokyo, Japan, on October 28, 2025. (Getty Images)
Cooperation in semiconductors and artificial intelligence is vital to the United States–Japan alliance. Two developments demonstrate the potential of this partnership: the Rapidus-IBM effort to produce advanced two-nanometer chips in Hokkaido, and Japan’s decision to be the first foreign partner in the Trump administration’s Genesis Mission for AI-powered research and development.
Join Hudson Institute’s Japan Chair for a conference to showcase and strengthen US-Japan cooperation in semiconductors and AI. US Deputy Under Secretary of Commerce for Innovation and Engagement Bill Guidera will deliver an opening keynote before engaging in a fireside chat with Senior Fellow William Chou.
Later, Rapidus CEO Atsuyoshi Koike, IBM CEO Arvind Krishna, and Director-General Kazumi Nishikawa of the Japanese Ministry of Economy, Trade, and Industry will deliver remarks. They will participate in a panel discussion and take questions from the audience.
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(Screenshot via YouTube)
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(Screenshot via YouTube)
